Laser-assisted cutting device
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United States of America Patent
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Nov 5, 2002
Issued Date -
N/A
app pub date -
Apr 7, 2000
filing date -
Jan 21, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides an apparatus for cutting wood or other materials by separating the material along a line of controlled failure through the application of mechanical force in combination with laser light to break molecular bonds holding the material together along the line of controlled failure. A preferred embodiment of the cutting apparatus is a generally broad wedge-shaped blade having planar lower and upper surfaces which converge toward each other to terminate along a leading edge. The blade is generally hollow with a cavity for passing optical fibers carrying laser light to a transparent window attached to the leading edge of the blade. Laser light passes through the window and is directed to a line of controlled failure in the material being cut to break the molecular bonds and locally weaken the material.
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