Active energy beam curable composition and printed wiring board
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United States of America Patent
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Nov 5, 2002
Grant Date -
Aug 22, 2002
app pub date -
Feb 12, 2001
filing date -
Feb 14, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is provided an active energy beam curable composition, which is useful for forming a solder resist film for a printed wiring board, which can be developed through an ultraviolet exposure and a dilute alkali aqueous solution, and is excel lent in heat resistance, adhesivity and chemical resistance. There is also proposed a printed wiring board provided with a cured film of such an active energy beam curable composition. This composition is featured in that it comprises not only an active energy beam curable vinyl copolymer modified resin wherein an epoxy compound having an ethylenic unsaturated group is added to a copolymer comprising styrene, (metha)acrylic acid, and, as an optional component, (metha)acrylate; but also an active energy beam curable bisphenol type epoxyacrylate resin.
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