Wire bonding apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 5, 2002
Grant Date -
May 30, 2002
app pub date -
Nov 16, 2001
filing date -
Nov 29, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wire bonding apparatus, which realizes a reduction in weight and inertia of a bonding arm and which allows high-speed Z-axis swinging, is disclosed. The wire bonding apparatus comprises a bonding head 3 fixed to an X-Y stage 30, a bonding arm 4 swinging in the Z-axis direction around a bonding head swinging shaft 13, a pair of wire clamp portions 7a and 7b, and an actuator for driving at least one of wire clamp portions 7a and 7b. At least, one portion of the actuator is provided on the bonding head 3 fixed onto the X-Y stage 30 so as to be spaced apart from the bonding arm 4, whereby a reduction in the weight and inertia of the bonding head 3 is achieved.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully