Method for measuring wafer thickness
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 5, 2002
Grant Date -
N/A
app pub date -
Dec 28, 1999
filing date -
Dec 28, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer edge grinding or polishing machine is provided with a pair of chucks for engaging a wafer therebetween, a fixed reference surface and a sensor which is movable with a movable chuck. Measurements are made by the sensor relative to the fixed reference plane when the movable chuck is in engagement with the opposite chuck without a wafer therebetween in order to obtain a standard measurement value. With a wafer between the chucks, the sensor obtains an actual measurement value relative to the fixed reference surface. A calculator determines the difference between the standard and actual measurements values and displays the difference as the thickness of the wafer. Multiple sensors may be used to obtain multiples readings which are averaged by the calculator to obtain a thickness measurement.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully