Thin copper film directly bonded polyimide film and method of manufacturing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 29, 2002
Grant Date -
N/A
app pub date -
Oct 6, 2000
filing date -
Jun 27, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Provided is a thin copper film directly bonded polyimide film in which a thin copper film is directly and strongly connected to a polyimide film. This thin copper film directly bonded polyimide film includes a polyimide film modified by bonding an organic silane compound having a cyano group represented by formula --Si(R--CN).sub.n (wherein R represents alkyl group having 1 to 6 carbon atoms and n represents a positive number from 1 to 3) to a carbon atom on the surface of the polyimide film, and a thin copper film directly bonded to the modified surface of the polyimide film.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully