Seed layer of copper interconnection via displacement
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United States of America Patent
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Oct 29, 2002
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N/A
app pub date -
Jul 10, 2001
filing date -
Jul 10, 2001
priority date (Note) -
Expired
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Abstract
A process for the fabrication of submicron copper interconnection useful on IC structures without deposition of copper seed is described. A dense metal layer can be deposited through contact displacement reaction between diffusion barrier layer and metal ions in solution under appropriate conditions. The metal layer formed by the displacement deposition can serve as the conducting material for subsequent copper electroplating. Moreover, the costly process for applying seed layer through CVD or PVD can be eliminated.
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