Lead frame and method for plating the same
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United States of America Patent
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Oct 22, 2002
Grant Date -
N/A
app pub date -
Jan 27, 2000
filing date -
Oct 1, 1999
priority date (Note) -
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Abstract
A lead frame for a semiconductor package and a method for manufacturing the lead frame. In the manufacture of the lead frame, a protective layer is formed with nickel (Ni) or Ni alloy on a metal substrate, an intermediate layer is then formed with palladium (Pd) or Pd alloy on the protective layer. Then, Pd and gold (Au) are alternately plated on the surface of the intermediate layer to form an outermost layer including both Pd and Au particles thereon.
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