Integrated circuit package with diamond heat sink
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United States of America Patent
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-
Oct 15, 2002
Grant Date -
N/A
app pub date -
Jul 1, 1994
filing date -
Jul 1, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An IC package includes a high thermal conductivity insulating material substrate, such as polycrystalline diamond, on which the IC is mounted for thermal management. The electrical lead pins of the package are electrically connected to the IC and thermally connected to the substrate.
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