Electronic package structure utilizing aluminum nitride/aluminum composite material
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United States of America Patent
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Oct 15, 2002
Issued Date -
N/A
app pub date -
Jul 29, 1997
filing date -
Dec 21, 1994
priority date (Note) -
Expired
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Abstract
A packaged electronic structure includes an electronic device, and a package to which the electronic device is affixed. At least a portion of the package is made of a composite material of aluminum nitride dispersed in aluminum. The composite material is preferably prepared by mixing powders of the aluminum nitride and aluminum, and thereafter pressing and sintering the mixture.
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