Hot melt pressure sensitive positioning adhesive
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United States of America Patent
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Oct 15, 2002
Grant Date -
N/A
app pub date -
Jun 22, 2000
filing date -
Jun 25, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is a hot melt pressure sensitive positioning adhesive for use with an absorbent article. The adhesive comprises: (a) from greater than 6 to less than 15 percent by weight of the total of (a), (b) and (c) of a hydrogenated styrene-(butadiene and/or isoprene)-styrene block copolymer having a vinyl content of greater than 50% by weight; and (b) from 50 to 80 percent by weight of the total of (a), (b) and (c) of a tackifying resin which has an aromaticity such that the MMAP cloud point is at least 45.degree. C.; and (c) from 5 to 35 percent by weight of the total of (a), (b) and (c) of a plasticizer.
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