Semiconductor chip removing and conveying method and device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 8, 2002
Grant Date -
Dec 6, 2001
app pub date -
Dec 26, 2000
filing date -
May 31, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Semiconductor chips are formed on a wafer. The wafer is diced, while a dicing tape applied to the wafer is kept intact. Each of the semiconductor chips is fixed by suction and then removed from the dicing tape. Each of the semiconductor chips is unfixed by ceasing the suction and picked up and conveyed.
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