Ready-to-mount heat dissipating assembly
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 1, 2002
Grant Date -
N/A
app pub date -
Oct 10, 2000
filing date -
Jul 5, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat dissipating assembly includes a heat sink (12) and a pair of clips (14). The heat sink has a base (20) defining a pair of slots (24) spaced from each other, and a plurality of fins (22) extending from a top surface of the base between the slots. The clip defines a pressing body (40) and two legs (50) extending from opposite ends of the pressing body, each leg defining an aperture (52). A horizontal portion (48) formed at the middle of the pressing body forms a U-shaped hook (42) extending downward from one side edge thereof. The hook is elastically deformable to be engagingly and interferentially received in the slot of the base of the heat sink for attaching the clip to the heat sink. The assembly is a singe unit ready to be conveniently mounted onto an electronic device.
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