ENCAPSULATED SEMICONDUCTOR DIE PACKAGE, AND METHOD FOR MAKING SAME
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United States of America Patent
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Oct 1, 2002
Grant Date -
Oct 3, 2002
app pub date -
Mar 27, 2001
filing date -
Mar 27, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor die package has a lead frame, a die attached to the lead frame and an encapsulant enclosing the lead frame and the die. The distance between the top outside face of the encapsulant and the frame is substantially equal to the distance between the bottom outside face of the encapsulant and the die, and the distance between the top outside face of the encapsulant and the frame is substantially two and half times the distance between the bottom outside face of the encapsulant and the lead frame. Consequently, the different thickness of different encapsulant portions achieves an optimum balance during curing that effectively reduces the deformation of the encapsulant. In addition, the encapsulant can be completely formed by an injection process, and no crack will form in the encapsulant.
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