Apparatus for sealing a semiconductor device utilizing a release film
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Oct 1, 2002
Issued Date -
N/A
app pub date -
Aug 30, 2000
filing date -
Jan 23, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A resin sealing method for sealing a joining portion between a semiconductor chip 12 and a substrate 10 by filling a underfilled portion of a molded piece 40 in which a semiconductor chip is mounted on a substrate with solder bumps studded therebetween with sealing resin 14 by a transfer molding process, the method being characterized in that when the molded piece 40 is clamped with a mold of a transfer molding machine, the perimeter of the underfilled portion, except the end of a gate continuous to the underfilled portion, is closed with a release film 20, and in a state that the perimeter of the underfilled portion is closed, the sealing resin 14 having been supplied to a pot 42 provided in the mold is fed under pressure to the underfilled portion, to thereby fill the underfilled portion.
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