QFN semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 1, 2002
Grant Date -
N/A
app pub date -
Nov 13, 2000
filing date -
Nov 13, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A QFN semiconductor package comprises a semiconductor die, a lead frame, bonding wires and a molding compound. The die has an upward topside with a plurality of bonding pads. The lead frame consists of a plurality of inner leads, wherein each inner lead is divided into the front finger portion, the middle protruding portion and the rare connecting portion. The front finger portion is the position of the inner lead to which a bonding wire wire-bonds from the bonding pad of the die. The rare connecting portion is for the electrical out-connection of the package. The middle protruding portion is at height level higher than the front finger portion and the rare connecting portion. The bonding wires electrically connect the bonding pads of the die with the front finger portions of inner leads by means of wire-bonding. A molding compound seals off at least said bonding wires and at least exposes the downside of the die and some surface of the rare connecting portion of each inner lead, therefore improve stability of the inner lead whenever during wire-bonding or after encapsulating.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully