Thermoplastic resin composition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 1, 2002
Grant Date -
Mar 7, 2002
app pub date -
Jul 13, 2001
filing date -
Jul 24, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A thermoplastic resin composition comprising 40 to 95 parts by weight of (a) a saponified ethylene-vinyl acetate copolymer resin and 60 to 5 parts by weight of (b) at least one selected from the group consisting of copolymers of a vinyl aromatic compound with a conjugated diene compound, and hydrogenated derivatives thereof, characterized in that the saponified ethylene-vinyl acetate copolymer resin (a) has an ethylene content of 40 to 95 wt % based on a weight of the saponified ethylene-vinyl acetate copolymer resin and a degree of saponification of the vinyl acetate of at least 80 wt % and (b)at least one selected from the group consisting of copolymers of a vinyl aromatic compound with a conjugated diene compound is selected from the group consisting of (b-1) block copolymers of a vinyl aromatic compound with a conjugated diene compound, and hydrogenated derivatives thereof and (b-2) hydrogenated random copolymers of a vinyl aromatic compound with a conjugated diene compound, the copolymers having a vinyl aromatic compound content of at most 50 wt %, a number average molecular weight(Mn) of from 5,000 to 1,000,000, a polydispersity(Mw/Mn) of at most 10, and a content of vinyl bonds derived from the conjugated diene compound of at least 10% based on bonds derived from the conjugated diene compound.
First Claim
Other Claims data not available
