Sn-Cu alloy plating bath
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United States of America Patent
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Oct 1, 2002
Grant Date -
N/A
app pub date -
Oct 5, 2000
filing date -
Oct 7, 1999
priority date (Note) -
Expired
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Abstract
An acidic Sn--Cu alloy plating bath composition comprising: (a) Sn.sup.2+ ions and Cu.sup.2+ ions, (b) at least one acid selected from the group consisting of alkane sulfonic acids, alkanol sulfonic acids, and sulfuric acid, and (c) a thiourea compound. The composition exhibits high current efficiency and does not cause Cu to deposit on the Sn anode, the Sn--Cu alloy plating bath is free from such problems as inadequate adhesion of the plating to substrate and covering of with copper deposit. Moreover, processing waste water from the Sn--Cu plating bath is easy because the composition does not contain a complexing agent. The Sn--Cu alloy plating bath of the present invention, therefore, can advantageously produce not only Sn--Cu alloy plating but also ternary alloy plating containing other metals in an industrial scale.
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