Hot melt pressure sensitive positions adhesive (II)
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Sep 24, 2002
Grant Date -
N/A
app pub date -
Jun 22, 2000
filing date -
Jun 25, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is a hot melt pressure sensitive positioning adhesive for use with an absorbent article. The adhesive comprises: (a) from 6 to less than 15 percent by weight, of the total of (a), (b) and (c) of a blend of (i) from 40 to 95% by weight of a hydrogenated styrene-(butadiene and/or isoprene)-styrene block copolymer; and (ii) from 5 to 60% by weight of a blend of a hydrogenated styrene-isoprene-styrene-isoprene block copolymer; and (iii) from 0 to 40% by weight of an amorphous ethylene/propylene copolymer having a number average molecular weight of 9,000 to 30,000; and (b) from 50 to 80 percent by weight, of the total of (a), (b) and (c), of a tackifying resin which has an aromaticity such that the MMAP cloud point is at least 45.degree. C.; and (c) from 5 to 35 percent by weight, of the total of (a), (b) and (c), of a plasticizer.
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Patent Citation Ranking
- 13 Citation Count
- C08L Class
- 61.38 % this patent is cited more than
- 23 Age