Impregnating, casting and coating compounds for electrotechnical and/or electronic components and for carrier materials for plane insulating materials
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United States of America Patent
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Sep 24, 2002
Grant Date -
Jun 27, 2002
app pub date -
Feb 2, 2000
filing date -
Mar 19, 1997
priority date (Note) -
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Abstract
The subject of the present invention is the use of a resin composition (A) comprising A1) at least one unsaturated polyester resin, A2) at least one vinyl ether having a viscosity of less than 4000 mPa.multidot.s at 25.degree. C., A3) if desired, at least one further polymer and/or oligomer, A4) if desired, at least one curing accelerator, A5) if desired, at least one ethylenically unsaturated reactive diluent, and A6) if desired, further customary additives, as impregnating, casting and coating compositions for electrical and/or electronic components and for carrier materials for sheetlike insulating materials. The present invention additionally relates to coating compositions suitable for this purpose which can be cured with low emissions.
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