Magnetron sputtering source
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United States of America Patent
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-
Sep 24, 2002
Issued Date -
N/A
app pub date -
Jun 25, 2001
filing date -
Dec 17, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A sputter source has at least two electrically mutually isolated stationar bar-shaped target arrangements mounted one alongside the other and separated by respective slits. Each of the target arrangements includes a respective electric pad so that each target arrangement may be operated electrically independently from the other target arrangement. Each target arrangement also has a controlled magnet arrangement for generating a time-varying magnetron field upon the respective target arrangement. The magnet arrangements may be controlled independently from each others. The source further has an anode arrangement with anodes alongside and between the target arrangements and/or along smaller sides of the target arrangements.
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