High molecular weight epoxy resin and resinous composition for printed circuit board
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United States of America Patent
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Sep 17, 2002
Grant Date -
N/A
app pub date -
Nov 2, 2000
filing date -
Mar 21, 2000
priority date (Note) -
Expired
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Abstract
A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100% by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.
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