Overlay material for plain bearing
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United States of America Patent
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Sep 17, 2002
Grant Date -
Mar 14, 2002
app pub date -
Nov 6, 2001
filing date -
Jul 5, 1997
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Expired
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Abstract
A lead-free multilayer material for plain bearings and a process for the production of corresponding bearing shells for improved emergency running and mechanical load-carrying capacity characteristics. The multilayer bearing material comprises a lead-free copper alloy having a copper content ranging from 50 to 95 wt. %, and an overlay formed of a lead-free tin and copper having a tin content ranging from 70 to 97 wt. % and a copper content ranging from 3 to 20 wt. %.
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