Pad transfer apparatus for chemical mechanical planarization
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United States of America Patent
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-
Sep 17, 2002
Grant Date -
N/A
app pub date -
Oct 20, 2000
filing date -
Oct 28, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system provides a polishing pad for chemical mechanical planarization of an object larger in diameter than the polishing pad. The system comprises a magazine including a bottom for exposing at least a portion of a puck which holds a polishing pad, and a transfer apparatus for transferring the puck from the magazine in the first region to a pickup stand in a second region. The transfer apparatus includes a puck support being movable to retrieve the puck from the bottom of the magazine by coupling a capture portion of the puck support with an exposed portion of the puck and moving the puck with the puck support away from the magazine.
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