Method of producing a surface acoustic wave component
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United States of America Patent
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Sep 17, 2002
Grant Date -
Aug 2, 2001
app pub date -
Feb 28, 2001
filing date -
Dec 21, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making a SAW component has electrically conductive structures on a substrate. A cap cover encapsulates and seals the structures against environmental influences. An RF shield is placed on the cap cover. The RF shield is a metallization formed of a material layer sequence of TiW, Cu or Ni and Au which is then reinforced with current-less or galvanic deposition.
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