Inboard retention system for processor enclosure assemblies with substrate alignment
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United States of America Patent
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Sep 10, 2002
Grant Date -
N/A
app pub date -
Jun 8, 1998
filing date -
Jun 8, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A retention mechanism which may include a pair of flexible tabs. The flexible tabs may be pressed into opposing side edges of a substrate which supports an integrated circuit package. The substrate may be part of an electronic cartridge which has a cover. The flexible tab may extend through a space between the substrate and the cover such that the retention mechanism has a profile that is no greater than the cartridge. The retention mechanism may be mounted to a motherboard. The motherboard may have a connector that receives the substrate. An insertion tool can be used to plug the cartridge into the connector and couple the flexible tab to the substrate. An extraction tool can be used to pull the cartridge out of the connector and separate the substrate from the flexible tabs.
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