Base material for a printed circuit board formed from a three-dimensional woven fiber structure
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United States of America Patent
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-
Sep 10, 2002
Grant Date -
N/A
app pub date -
Mar 20, 2000
filing date -
Mar 20, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A base material for a printed circuit board, and a printed circuit board constructed therefrom. The base material is formed from a three-dimensional orthogonally woven fabric having a crimp-free fiber architecture in the x-y plane and an integrated multi-layer structure. The base material comprises a first system of straight first fibers extending along a first direction in a first plane, a second system of straight second fibers extending along a second direction in a second plane parallel to the first plane, and a third system of third fibers extending along a third direction through the first and second systems and binding the first and second fibers thereof. A filler material coats a portion of the first, second and third systems. The printed circuit board comprises the base material and one or more conductive layers attached to surfaces of the base material.
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