Method of resin molding
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United States of America Patent
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Sep 3, 2002
Issued Date -
N/A
app pub date -
Jun 2, 1998
filing date -
Nov 24, 1994
priority date (Note) -
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Abstract
A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the molding dies 15 is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.
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