PROCESS FOR PRODUCING HEAT-RESISTANT INTERMETALLIC COMPOUND NI3AL FOIL HAVING ROOM-TEMPERATURE DUCTILITY AND HEAT-RESISTANT INTERMETALLIC COMPOUND NI3AL FOIL HAVING ROOM-TEMPERATURE DUCTILITY
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 3, 2002
Grant Date -
N/A
app pub date -
Oct 20, 2000
filing date -
Oct 21, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for producing a heat-resistant intermetallic compound Ni.sub.3 Al foil having a room-temperature ductility, which comprises a first step of arc-melting an alloy having a chemical composition containing Ni as a main component and Al to form a starting rod, a second step of growing the starting rod in columnar crystal form by unidirectional solidification, a third step of cutting out the unidirectionally solidified rod to form a plate, and a fourth step of cold-rolling the plate cut at room temperature to form a foil. The invention can provide a process for producing a thin Ni.sub.3 Al foil which has a thickness of 200 microns or less and which is excellent in high-temperature strength, oxidation and corrosion resistances and room-temperature ductility.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully