Clear coating for digital and analog imagers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 27, 2002
Grant Date -
N/A
app pub date -
May 9, 2001
filing date -
May 9, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor die with an imager sensor on an integrated circuit (IC) is mated directly to a substrate, such as a printed circuit board or any traditional chip carrier. A retaining well is built by adding an elevated structure about the mated IC chip with an inexpensive epoxy compound, forming a recess in which the IC is disposed. Thereafter, a coating layer of a viscous epoxy is added to the well and allowed to cure. The coating is clear, allowing light to pass to the IC chip. The epoxy along with the substrate encapsulates the IC chip, providing an easy and inexpensive chip package. The substrate may comprise a laminate substrate that is preprinted with easily reconfigurable leads and multi-layer routing arranged to minimize noise and cross-talk. The coating, or an additional coating placed on top of or underneath the clear coating, may also perform filtering of one or more portions of the light spectrum. The IC may alternatively comprise any type of circuitry that responds to received light or that generates light.
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