Photosensitive resin composition and process for producing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 27, 2002
Grant Date -
Jan 31, 2002
app pub date -
Aug 18, 1999
filing date -
Dec 19, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A photosensitive resin composition comprises a base resin (e.g., novolak resins, polyvinylphenol-series polymers), a first photoactive ingredient (e.g., diazobenzoquinone derivatives, diazonaphthoquinone derivatives) and a second photoactive ingredient (e.g., mixtures with azide compounds) each having an absorption range at wavelength .lambda.1 or .lambda.2, the wavelengths thereof being different from each other. Between the first and second photoactive ingredients, at least one photoactive ingredient is substantially inert at the absorption wavelength of the other. After exposing the photosensitive resin composition to a light to form a pattern, the whole surface of the photosensitive layer is exposed to a light of the other wavelength to make the surface hardly soluble (in the case a positive pattern is formed) or readily soluble (in the case a negative pattern is formed) in a developer, and developed, thereby forming a pattern of high resolution. Utilizing an existing exposure system, there can be obtained photosensitive resin compositions (especially, resists for semiconductor production) having improved sensitivity and resolution.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully