Semiconductor package with metal pads
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United States of America Patent
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Aug 20, 2002
Grant Date -
N/A
app pub date -
May 11, 2001
filing date -
May 11, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor package is disclosed, such as QFN, SON. The semiconductor package includes a die, a package body for protection of a die, and a plurality of leads. A metal pad formed by some partial downside surface of each lead is located on a downside surface of the package body with coplanarity. Each lead has a cutting surface exposed on a corresponding lateral surface of the package body. The cutting surface has an interval with the plane of forming the metal pads by means of selectively self-etching the leads or stamping to bend the leads in order to avoid forming a cutting sharp edge in the brim of the metal pad after cutting.
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