Reflow soldering apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 20, 2002
Issued Date -
N/A
app pub date -
Jun 18, 2001
filing date -
Aug 14, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A reflow soldering apparatus using circulated heated gas to solder electronic components to a printed circuit board while transporting the printed circuit board mounted with electronic components on a conveyor chain. A plurality of gas passages for inflow of heated gas which have openings facing the circuit board, are provided at intervals in the transport direction of the conveyor chain. A first passage is provided for the flow of heated gas into the fan from an opening different from the opening for inflow and formed in the intermediate portion of the gas passage, and a second passage is provided for the flow of heated gas into the fan from openings formed on both ends of the gas passage.
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