Positive photosensitive resin composition, process for producing pattern and electronic parts
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United States of America Patent
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Aug 20, 2002
Grant Date -
N/A
app pub date -
Sep 21, 2000
filing date -
Sep 28, 1999
priority date (Note) -
Expired
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Abstract
Disclosed are a positive type photosensitive resin composition which comprises (A) a polyimide precursor or a polyoxazole precursor having a group represented by --OR, wherein R represents a monovalent group constituting a acetal or ketal, an alkoxyalkyl group or an alkylsilyl group, which can be converted into a hydrogen atom by decomposition with an action of an acid, in the molecule which is bonded to an aromatic ring, and (B) a compound which generates an acid by irradiating radiation, a process for producing the same and electronic parts using the same.
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