Formation of thin film capacitors
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United States of America Patent
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Aug 13, 2002
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N/A
app pub date -
Mar 31, 1999
filing date -
Nov 23, 1998
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Abstract
Thin layer capacitors are formed from a first flexible metal layer, a dielectric layer between about 0.03 and about 2 microns deposited thereon, and a second flexible metal layer deposited on the dielectric layer. The first flexible metal layer may either be a metal foil, such as a copper, aluminum, or nickel foil, or a metal layer deposited on a polymeric support sheet. Depositions of the layers is by or is facilitate by combustion chemical vapor deposition or controlled atmosphere chemical vapor deposition.
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