Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism
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United States of America Patent
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Aug 13, 2002
Grant Date -
N/A
app pub date -
Apr 29, 1999
filing date -
Jul 24, 1998
priority date (Note) -
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Abstract
A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outside the resin package, the outer lead parts being bent along the shape of the resin package so as to form first terminal parts on the second surface and second terminal parts on the first surface; connection means electrically connecting the semiconductor chip and the leads; and a positioning mechanism provided either on the leads or on the resin package, which positions the outer lead parts by engaging a part of the outer lead parts to the resin package. Further, at least one of the leads and/or connection means is cut so as to electrically disconnect the semiconductor chip and the one of the leads and/or connection elements.
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