Molded assembly with heating element captured therein
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United States of America Patent
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Aug 13, 2002
Grant Date -
N/A
app pub date -
Apr 7, 2000
filing date -
Apr 7, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A heated element assembly and method of manufacturing heated element assemblies is provided. The heated element assembly including a first and second molded sections shaped to mate with each other is provided. A resistance heating element is secured between the first and second molded sections by an interference fit. The resistance heating element includes a piercable supporting substrate and a resistance wire sewn thereon. The resistance wire is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded sections. The resistance heating element is easily fixed in a position between the first and second molded sections and is capable of providing heat on vertical, horizontal and contoured surfaces.
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