Surface mount feedthrough
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United States of America Patent
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Aug 13, 2002
Grant Date -
N/A
app pub date -
Mar 14, 2001
filing date -
Mar 14, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A microcircuit package feedthrough that relates to glass-to-metal seals, and more particularly, to feedthroughs for use in surfacemount microcircuit packages. The present invention can be used with surface mount technology such that it is a microcircuit package feedthrough that requires fewer manufacturing steps to install than conventional feedthroughs.
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