Grounding scheme for a high speed backplane connector system
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Aug 13, 2002
Grant Date -
N/A
app pub date -
Jun 4, 2001
filing date -
Jun 4, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A modular electrical connector comprising a plurality of wafers and shielding plates, each wafer having an insulative housing and a plurality of contact elements extending therethrough, the wafer having two side surfaces with slots formed therethrough to isolate each adjacent pair of contact elements within the wafer, each shielding plate having a plurality of ribs extending outwardly from at least one of two side surfaces thereof and being mounted between two adjacent wafers with each rib fitted within a corresponding slot to shield each adjacent pair of contact elements.
First Claim
all claims..Other Claims data not available
Family
- No Family data available.
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
HON HAI PRECISION IND CO LTD | 66 CHUNG SHAN ROAD TU-CHEN TAIPEI HSIEN |
International Classification(s)

- 2001 Application Filing Year
- H01R Class
- 2648 Applications Filed
- 930 Patents Issued To-Date
- 35.13 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Billman, Timothy B | Dover, PA | 67 | 2310 |
# of filed Patents : 67 Total Citations : 2310 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 173 Citation Count
- H01R Class
- 99.55 % this patent is cited more than
- 23 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Jan 04, 2021 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: MICROENTITY |
Jan 04, 2021 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Nov 29, 2020 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Nov 29, 2020 |
Jul 20, 2020 | FEPP | FEE PAYMENT PROCEDURE | free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: MICROENTITY |
Nov 29, 2016 | I | Issuance | |
Nov 09, 2016 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Jul 07, 2016 | P | Published | |
Aug 11, 2014 | F | Filing | |
Sep 04, 2013 | PD | Priority Date |

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