Grounding scheme for a high speed backplane connector system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6431914
SERIAL NO

09874621

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Abstract

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A modular electrical connector comprising a plurality of wafers and shielding plates, each wafer having an insulative housing and a plurality of contact elements extending therethrough, the wafer having two side surfaces with slots formed therethrough to isolate each adjacent pair of contact elements within the wafer, each shielding plate having a plurality of ribs extending outwardly from at least one of two side surfaces thereof and being mounted between two adjacent wafers with each rib fitted within a corresponding slot to shield each adjacent pair of contact elements.

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Patent Owner(s)

Patent OwnerAddress
HON HAI PRECISION IND CO LTD66 CHUNG SHAN ROAD TU-CHEN TAIPEI HSIEN

International Classification(s)

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  • 2001 Application Filing Year
  • H01R Class
  • 2648 Applications Filed
  • 930 Patents Issued To-Date
  • 35.13 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20012002200320042005200620072008200920100255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Billman, Timothy B Dover, PA 67 2310

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Patent Citation Ranking

  • 173 Citation Count
  • H01R Class
  • 99.55 % this patent is cited more than
  • 23 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges4050828112961411210941501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475500525550

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