Solder ball placement apparatus
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United States of America Patent
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Aug 6, 2002
Issued Date -
N/A
app pub date -
Feb 6, 1997
filing date -
Feb 6, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.
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