Importance

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Abstract

Probe testing of an integrated circuit so as to achieve low probe needle contact resistance without probe needles 'scrubbing' against bonding pads is achieved at high test signal frequencies by a probe needle assembly (14) including a plurality of probe needles (13) each having a shank portion (13A), a curved flex portion (13B), and a contact tip (13C) on a free end of the flex portion, the shank portion (13A) being electrically coupled to an electrical test system. The shank portion (13A) of each probe needle is attached to a surface (16A) of an insulative layer (16). The insulative layer is supported on a ground plane conductor 25. The flex portions (13B) of the probe needles (13) extend beyond an edge of the insulative layer. A portion (24) of the ground plane conductor (25) extends beyond the insulator (16) and is adjacent to all but an extending tip portion (30) of the flex portion (13B) of each probe needle (13). A thin insulator/guide layer (26B) is attached to the extending portion (24) of the ground plane conductor (25) and disposed between the extending portion and the flex portions (13B), the insulator/guide layer (26B) having a smooth, low friction surface to guide/stabilize the flex portions (13B) during flexing. The insulative layer (16) and insulator/guide layer (26B) provide matched impedance between the shank and flex portions of the probe needles.

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First Claim