Multi-probe test head and process using same
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United States of America Patent
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Jul 30, 2002
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N/A
app pub date -
Sep 30, 1999
filing date -
Jan 30, 1998
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Abstract
In a test head for a scanning probe microscope for the contactless testing of integrated electronic circuits, a group of probes produced by three-dimensional additive lithography is disposed on a substrate. The probes are directed at a point situated centrally above the group of probes. The conducting probes as well as the base end of the capacitive probe are joined to printed circuit trace structures on the substrate for connection to a test circuit.
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