Resin composition and injection-molded article
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United States of America Patent
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Jul 30, 2002
Grant Date -
Oct 18, 2001
app pub date -
Feb 12, 2001
filing date -
Mar 2, 2000
priority date (Note) -
Expired
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Abstract
A resin composition containing: (A) an ethylene-.alpha.-olefin copolymer having a melt flow rate of from 0.5 to 100 g/10 min, a density of from 860 to 920 kg/m.sup.3, and a highest melting peak temperature of from 50.degree. C. to 110.degree. C.; (B) an ethylene homopolymer or ethylene-.alpha.-olefin copolymer having a melt flow rate of from 0.5 to 100 g/10 min, a density of from 910 to 980 kg/m.sup.3, and a highest melting peak temperature of from 110.degree. C. to 135.degree. C.; and (C) a low-density polyethylene having a melt flow rate of from 0.5 to 100 g/10 min, and a swell ratio of from 1.3 to 2.0, provides a molded article superior in mold release properties, flexibility and heat resistance, particularly when used in injection molding.
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