Heat sink and memory module with heat sink
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United States of America Patent
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Jul 23, 2002
Grant Date -
Jan 3, 2002
app pub date -
Jun 14, 1999
filing date -
Jun 12, 1998
priority date (Note) -
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Abstract
A memory module 10 is fitted with a 'cover and heat sink' 5 having a U-shape in cross section in such a manner that the memory module 10 is inserted into a U-shaped deep recess of the 'cover and heat sink' 5, and all packaged memory ICs 3 and the other components 2 mounted on each face of a printed circuit board 1 are covered by the 'cover and heat sink' 5, with a silicone grease 6 being filled between the 'cover and heat sink' 5 and the packaged memory ICs 3. The heat generated in each packaged memory IC 3 is conducted to the 'cover and heat sink' 5 through the silicone grease 6, and the heat is radiated from the surface of the 'cover and heat sink' 5 having a large surface area. In addition, since all the components 2 and 3 mounted on the printed circuit board 1 are covered with the 'cover and heat sink' 5, the components 2 and 3 mounted on the printed circuit board 1 are protected from a mechanical shock. Furthermore, it is possible to discriminate whether or not the degree of the warping of the printed circuit board 1 exceeds a permissible limit. Because, if the warping of the printed circuit board exceeds a certain limit, the memory module cannot be inserted into the U-shaped deep recess of the 'cover and heat sink' 5.
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