Diamond interconnection substrate and a manufacturing method therefor
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United States of America Patent
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Jul 23, 2002
Grant Date -
Aug 30, 2001
app pub date -
Jan 16, 2001
filing date -
Jan 19, 2000
priority date (Note) -
Expired
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Abstract
An electrical connection board includes a diamond substrate and an implantation metal layer constituted by the presence of metal elements in the diamond substrate. The metal layer has a thickness of at least 10 nm and a concentration of at least 10.sup.20 cm.sup.-3 in the diamond substrate. The implantation metal layer is formed by ion implanting metal elements with a high energy level of at least 1 MeV and a high dose of at least 10.sup.16 cm.sup.-2. Thus, a technique is provided by which a multi-layer electrical interconnection is realized in the diamond substrate having the highest thermal conductivity of all known materials.
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