Reflow soldering apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 23, 2002
Grant Date -
Jun 28, 2001
app pub date -
Dec 20, 2000
filing date -
Dec 22, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This reflow soldering apparatus comprises a heater tip 10 for soldering sites to be soldered of a workpiece W by reflow method, a power supply unit for supplying an electric power for heat generation or heating to the heater tip, a control unit for providing a control of the supplied current in the power supply unit, and a pressing unit 16 for pressing the heater tip against the sites to be soldered of the workpiece W. An inverter of the power supply unit has four transistor switching elements. By the control unit by way of a driving circuit, the first set of switching elements and are simultaneously switching (ON/OFF) controlled at a predetermined inverter frequency (e.g., 10 kHz) in response to in-phase inverter control signals G.sub.1 and G.sub.3, whereas the second set of switching elements are simultaneously switching controlled at the inverter frequency in response to in-phase inverter control signals G.sub.2 and G.sub.4.
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