Method of filling a recess
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United States of America Patent
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Jul 23, 2002
Grant Date -
N/A
app pub date -
Mar 17, 2000
filing date -
Jul 11, 1997
priority date (Note) -
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Abstract
The invention relates to a process for filling a multiplicity of recesses (3) formed in an exposed surface of a workpiece (1), wherein the mouths of the recesses (3) are closed by the deposition of a layer (10) and the layer is subjected to elevated temperature and pressure to force material from the layer down into the recesses. In the particular embodiments described, the elevated temperature is achieved by supplying very short thermal pulses, for example, from a light source such as a laser or a halogen light and preferably this thermal pulse is applied after the elevated pressure has been achieved.
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