Slurry useful for wire-saw slicing and evaluation of slurry
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United States of America Patent
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Jul 23, 2002
Grant Date -
N/A
app pub date -
Aug 11, 2000
filing date -
Apr 26, 1999
priority date (Note) -
Expired
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Abstract
Slurry useful for wire-saw slicing has viscosity adjusted to 400-700 mPa.multidot.second at a shear speed of 2/second and of 50-300 mPa.multidot.second at a shear speed of 380/second. The viscosity of slurry is measured using a cone and plate type viscometer which can measure viscosity at different shear speeds. Since the slurry sufficiently flows into inner parts of grooves formed in an ingot and consumed for wire-saw slicing due to the viscosity controlled in response to the shear speed, the ingot can be efficiently sliced to wafers or discs.
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