Method for forming an integrated barrier/plug for a stacked capacitor
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United States of America Patent
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Jul 16, 2002
Grant Date -
N/A
app pub date -
Apr 18, 2000
filing date -
Apr 18, 2000
priority date (Note) -
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Abstract
A method of forming an integrated barrier/contact for stacked capacitors is provided which results in reduced cost of ownership and in a barrier which is nominally several times thicker than convention structures. The resulting structure results in decreased contact plug resistance as compared with conventional devices.
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