Method for producing package for housing photosemiconductor element
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United States of America Patent
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Jul 16, 2002
Grant Date -
N/A
app pub date -
Mar 24, 2000
filing date -
Mar 24, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An object of the present invention is to firmly attach a metallic fixing member to which an optical-fiber member is fixed, to a substrate. A tubular metallic fixing member, to one end of which an optical-fiber member is connected, is brazed and attached to a substrate housing a photosemiconductor element by depositing a nickel plating layer and a gold plating layer in succession on the surface thereof, subjecting the metallic fixing member into which a light-transmitting member is attached via glass, to an etching treatment, and removing nickel oxide formed on the surface of the gold plating layer.
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