Semiconductor component and method of manufacture
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 9, 2002
Issued Date -
N/A
app pub date -
Aug 7, 2000
filing date -
Aug 7, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of manufacturing a semiconductor component includes disposing a layer (120) of an electrically insulative material over a semiconductor substrate (110), etching a trench (310) into the layer and the semiconductor substrate, disposing a layer (410) of a semiconductor material in the trench, and forming a gate contact (1410) in the trench.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully